Tanner EDA and Sound Design Technologies Announce Process Design Kit (PDK) Collaboration for Thin Film Technologies
MONROVIA, Calif. & BURLINGTON, Ontario--Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs) and Sound Design Technologies (SDT), a leading designer and manufacturer of integrated passives and stacked-die assemblies, are collaborating to develop process design kits (PDKs) for analog/mixed-signal (A/MS) designers using Tanner EDA’s HiPer Silicon™ software. This collaboration gives Tanner EDA customers access to SDT’s innovative SiPArrayTM integrated passives technology and SDT customers access to Tanner EDA’s A/MS tools for a complete IC design solution.
“Tanner EDA offers a perfect blend of productivity, price-performance and interoperability that is ideally suited to the needs of our analog/mixed-signal IC design customers,” stated Ian Roane, president and CEO of Sound Design Technologies. “Our collaboration with Tanner EDA provides our mutual customers with an advanced design platform and powerful design capabilities to integrate passive components into stacked die assemblies to reduce board space. This will enable them to capitalize on advanced 3D packaging capabilities for breakthroughs in miniaturization and high performance solutions.”
“Our collaboration with Sound Design Technologies is another example of enabling innovation by bringing leading-edge process and packaging capability to our customers,” commented Tanner EDA’s president, Greg Lebsack. “Our specialized IC design software combined with SDT’s integrated passives and chip-stacking technologies arm A/MS designers with breakthrough capabilities to simultaneously save space, improve quality and reduce power requirements.”
Availability of PDKs
About Tanner EDA
Tanner EDA provides a complete line of software solutions that catalyze innovation for the design, layout and verification of analog and mixed-signal (A/MS) integrated circuits (ICs). Customers are creating breakthrough applications in areas such as power management, displays and imaging, automotive, consumer electronics, life sciences, and RF devices. A low learning curve, high interoperability, and a powerful user interface improve design team productivity and enable a low total cost of ownership (TCO). Capability and performance are matched by low support requirements and high support capability as well as an ecosystem of partners that bring advanced capabilities to A/MS designs.
Founded in 1988, Tanner EDA solutions deliver just the right mixture of features, functionality and usability. The company has shipped over 33,000 licenses of its software to more than 5,000 customers in 67 countries.
About Sound Design Technologies
Sound Design Technologies Ltd., based in Burlington, Ontario, Canada, is a leading provider of miniature microelectronics manufacturing and packaging techniques as well as ultra-low power digital signal processors (DSP). Previously a division of Gennum Corporation, SDT has a 35-year history of innovation in the area, with a broad array of technologies such as 3D Chip Stacking and high density SiPArray(TM) - Thin Film high density Capacitor Arrays, adaptable for integrated passive device applications, to provide the right packaging solution for each customer’s unique needs. Originally developed for hearing aids, SDT’s products and technologies today are deployed in numerous markets and applications worldwide, including biomedical & industrial sensors, blood analyzers, LED/industrial lighting and wireless monitors. For more information on SDT products and services, visit http://www.sounddesigntechnologies.com. SDT is a portfolio company of Global Equity Capital, LLC, headquartered in Boulder, Colorado. For more information, visit http://www.globalequitycap.com.
HiPer Verify and HiPer Silicon are trademarks of Tanner Research, Inc.
Sound Design Technologies, Sound Design Technologies logo, SiPArray,, thinSTAX are trademarks or registered trademarks of Sound Design Technologies, Ltd.
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