Tanner EDA Software Tools – Specialty Tools for Analog & Mixed Signal IC Design
Tanner EDA offers several specialty tools to enhance your productivity:
Layer Fill
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In today’s process nodes, specific density requirements are needed to reduce chemical-mechanical polishing (CMP) variability and improve layer stress.
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Layer Fill automatically adds shapes to empty areas of your chip on specified layers to have a specific density for better yield.
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Requires HiPer Silicon or HiPer Design
Pad IO Cross-Reference Extractor (Pad Map)
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Easy generation of bonding reports and creation of bonding diagrams for packaging.
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Available for L-Edit, L-Edit Pro, Tanner Tools Pro, HiPer Silicon, HiPer Design
Wafer Tools
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Used for Wafer or Recticle preparation
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Populates wafers with maximum number of die
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Adds unique polygon labels to each die on the wafer
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Analyzes existing placed die, deletes outside die, and trims layers inside crossing die
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Requires L-Edit
Gerber
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Import/Export Gerber format of your layout from L-Edit
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Supports both RS-274D and RS-274X Gerber files
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Requires L-Edit
Node Highlighting
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Connectivity visualization so you can quickly find and fix LVS problems.
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Point to an object in the layout, regardless of hierarchy, and display all the geometry connected to it based on a set of connectivity rules
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Highlight discrepancies between the schematic netlist and the extracted netlist in the layout
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View multiple nodes in different colors
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Track down shorts and opens
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Requires L-Edit
EVI
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Enables seamless integration with physical verification sign-off tools
- Provides an interface for users of Calibre® tool suite, to use L-Edit and S-Edit for layout and schematic capture
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Used in conjunction with the Calibre® RVE product, you can view Calibre® DRC errors, LVS results, and PEX parasitics in L-Edit and S-Edit
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Allows users to run DRC & LVS on L-Edit and S-Edit designs from within Calibre® Interactive
